Electronic Components Services
SEN-13763| Series | 116 |
|---|---|
| RoHS | RoHS |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
| Features | Elevated, Open Frame |
| Part Status | Active |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Mounting Type | Through Hole |
| Pitch - Mating | 0.100" (2.54mm) |
| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Contact Finish - Post | Tin |
| Operating Temperature | -55°C ~ 125°C |
| Contact Finish - Mating | Gold |
| Contact Material - Post | Brass |
| Contact Material - Mating | Beryllium Copper |
| Contact Finish Thickness - Post | - |
| Contact Finish Thickness - Mating | 29.5µin (0.75µm) |
| Number of Positions or Pins (Grid) | 6 (2 x 3) |
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