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24-6554-16

Part Number
24-6554-16<
Manufacturer
Aries Electronics<
Description
CONN IC DIP SOCKET ZIF 24POS<
Data sheet
24-6554-16

Specifications

Series55
RoHSRoHS
TypeDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
FeaturesClosed Frame
Part StatusActive
TerminationSolder
Pitch - Post0.100" (2.54mm)
Mounting TypeThrough Hole
Pitch - Mating0.100" (2.54mm)
Housing MaterialPolyphenylene Sulfide (PPS), Glass Filled
Contact Finish - PostNickel Boron
Operating Temperature-
Contact Finish - MatingNickel Boron
Contact Material - PostBeryllium Copper
Contact Material - MatingBeryllium Copper
Contact Finish Thickness - Post50.0µin (1.27µm)
Contact Finish Thickness - Mating50.0µin (1.27µm)
Number of Positions or Pins (Grid)24 (2 x 12)